BIO-MEDICAL- LIFE SCIENCES

These labs on a chip can duplicate the specialized functions of their room-sized counterparts, such as clinical diagnostics, DNA scanning, and electrophoretic separation. The advantages of these labs on a chip include dramatically reduced sample size, much shorter reaction and analysis time, high throughput, automation, and portability.


LAB ON A CHIP “LOC”

Noel Technologies partners with many bio companies & labs to produce novel products that utilize semiconductor processing and technology to produce labs on a chip.  Labs on a chip can duplicate the specialized functions of their room-sized counterparts, such as clinical diagnostics, DNA scanning, and electrophoretic separation. The advantages of these labs on a chip include dramatically reduced sample size, much shorter reaction and analysis time, high throughput, automation, and portability. Sequencing special materials for diseases, viruses, autoimmune, DNA can significantly shorten the time to diagnose a disease.

Applications utilize Noel thin films, lithography and etches.


MEMS

MEMS technology is an important and integral part of many new and innovating applications that are used as sensors, microfluidics, accelerometers, the list is endless.  All used in Life Sciences and Semiconductor applications.

The key microfluidic functions required in various lab-on-a-chip devices include pumping, mixing, thermal cycling, dispensing, and separating. Most of these processes are electrokinetic processes. Noel offers a full wafer fabrication facility, using semiconductor processing for novel applications such as Lab on a chip, chiplet technology that can offer very quick processing time, in a US based facility. The company has supported many applications.

Applications utilize Noel thin films, lithography and etches.


SEMICONDUCTOR

The semiconductor industry has entered a new era and the role of design including the package has become increasingly important. No longer can the industry count on monolithic integration to achieve the economic gains of the previous era. New packaging solutions are being adopted to achieve the economic advantages that were previously met with silicon scaling. The role of heterogeneous integration, especially chiplets, is pivotal in this new era. In fact, TSMC indicates that the use of chiplets will be one of the most important developments for the next 10 to 20 years.

Applications utilize Noel thin films, lithography and etches.