Thin Films

Thermal Oxide & LPCVD Films

Noel Technologies custom Diffusion Furnaces for Thermal Oxide and LPCVD thin films can accommodate 300mm wafer diameter to smaller substrates. Noel engineers apply decades of experience and production expertise to configuring our customized diffusion furnaces. Starting with Thermco furnaces, Noel improves the design with the addition of low profile cantilevers and special perforated panels which facilitate cleaner operation. Automated wafer transfer equipment and advanced air ionization are used extensively throughout the cleanroom. All critical production areas are rated Class 100. Proprietary processes enable Noel to deliver the highest quality films with extremely low metals and minimal particle contributions. Film thickness and uniformity is measure on a Filmetrics mapping system.

PECVD Films

Noel’s Plasma Enhanced Chemically Evaporated Deposition System handles 200mm and smaller substrate and wafer diameters. Flexible film thicknesses offer customers an opportunity to extensively develop new processes. Film thickness and uniformity is measured on a Film metric’s data system.

PVD Thin Film Metals

Capability includes 300mm wafer diameter to smaller substrates and specialty dimensions. Films include Titanium, Titanium Nitride, Aluminum, and Chrome. Film thickness is measured on an Alpha Step or a P-15 Profiler.