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	Press Releases
	For more information please contact:
	Robert Goldberg Robert Goldberg & Assoc. T: (510) 238-0800 F: (510) 238-8554 info@adfarm.com or	Kristin Boyce Noel Technologies, Inc. T: (408) 374-9549 F: (408) 374-4127 kristin@noeltech.com
	For Immediate Release January, 2006 Noel Technologies Expands Service Offering To Include Blanket Resist Coatings And Photolithography Services On Wafers Up To 300mm Campbell, CA - Noel Technologies has announced today that dedicated staff and equipment are now in place to provide photolithography services and blanket resist coatings on 300mm, 200mm, 150mm and 100mm wafers. These new service solutions target the semiconductor, semiconductor equipment manufacturing, bio-medical, and industrial market places. The expanded service offering is the latest in Noel Technologies extensive list of specialized foundry services. The suite of services includes a fully-integrated and automatic test wafer recovery program, low particle thin film deposition and particle measurement capabilities. Noel now offers a large inventory of test, monitor and prime wafers (in all standard sizes) for low particle thin film applications. The continuing objective at Noel Technologies is to provide a single resource to those customers requiring wafers, films, blanket spins, photolithography, plasma etch, wet & dry etch, wafer reclaim/conservation strategies, particle measurement and a variety of other products and services. All services are provided under one roof in the company’s expanded, Silicon Valley facility. Photolithography Capabilities: Noel Technologies now offers single and multi-layer lithography services on wafer sizes of 100mm to 300mmm with minimum feature sizes of .4um for stepped lithography and 2.0um for proximity patterning. Customers may select one of Noel Technologies in-house reticle patterns, or create their own die layout with the support of a highly skilled technical staff. CAD services, data processing and reticle generation are readily available through Noel Technologies long-standing partner ships with leading mask houses to create both single layer pattern designs or multi-layer reticle sets; requiring alignment schemes and biasing inclusions. I-Line and DUV Blanket Coatings: Uniform resist coatings are now available for 6", 8" and 12" wafers. With thickness ranges of 5KA to 50KA, within wafer non-uniformities of < +/- 1% , Noel Technologies "Blanket Spins" set a new precedent in coating quality . Whether applications needs are extended marathon runs, etch selectivity studies or determining resist removal rates, Noel Technologies guarantees consistent and repeatable blanket coatings. For Immediate Release August 20, 1999 NOEL Technologies Introduces Proprietary Reduced Particle Clean for 300mm Wafers Campbell, CA - Noel Technologies, Inc. announces the introduction of a Reduced Particle Clean (RPC) for 300mm wafers, a proprietary scrub process which loosens contaminants and particles, resulting in an ultra low particle clean. The tool is a single wafer cleaning scrub, as opposed to Spin Rinse Dry (SRD) clean, which is accomplished in a SRD rinser dryer in batch loads. Noel’s RPC process can bring wafers ranging to 12" down to single digits in particles and double digits on 12" wafers. Noel Technologies’ 300mm Reduced Particle Clean Noel Technologies’ RPC process for 300mm wafers is the leading reclaim technology offered among similar services. Custom manufactured equipment and process chemicals attribute to the superior results of Noel’s RPC on reclaimed wafers of all sizes. Faster and more cost effective Reclamation of 300 mm wafers can cost up to $250 per wafer and require a turnaround time of 4-6 weeks; whereas, Noel’s RPC for 12" wafers can cut recovery cost to $100 per wafer with a turnaround of only 1 week. Noel’s RPC process proves both cost effective and timely considering 50% or more wafers sent for recovery are within spec for recycle and are not yet in need of reclaim. “Our Reduced Particle Clean for 300 mm wafers represents the latest in cleaning technologies,” states Mr. Leon Pearce, Noel Technologies’ Chairman and Director of Technology. “Cleaner wafers entering the process environment will result in lower LPDs on the final product.” Noel Technologies provides specialized wafer foundry services including a fully integrated test wafer recovery program, low particle thin film deposition and particle measurement. Additionally, Noel offers new test, monitor and prime wafers for low particle thin film requirements. For further information regarding wafer reclamation and thin film services, please contact Ms. Kristin Boyce at Noel Technologies, Inc. (408) 374-9549. Located in the Silicon Valley and founded in 1996, Noel Technologies, Inc. is a leading provider of semiconductor wafers, custom thin films, wafer recovery and particle measuring services. For more information contact info@noeltech.com. From A²C² Magazine, Article: “How They Do It” NOEL Technologies Introduces Proprietary, Copper Strip Process Campbell, CA - Noel Technologies, Inc. announces the introduction of a new, highly effective copper strip process for 6", 8" and 12" wafers. This proprietary scrub process utilizes a wafer spin clean method which removes copper material/residue one wafer at a time, resulting in ultra low particle counts on substrates up to 300mm. This method utilizes a single wafer cleaning scrub, (as opposed to the Spin Rinse Dry method), and a specialized chemical rinse which is designed to provide maximum copper material removal while maintaining substrate integrity and wafer thickness. Noel’s exclusive copper strip process Noel Technologies’ environmentally friendly, single wafer process begins by removing the copper from the wafer using carefully timed, multiple applications of fresh ozonized DI water combined with a specially formulated HF solution. The chemical materials required are approximately 25% of the total required by many other methods. Performed at room temperature, the highly effective, multiple cleaning cycles require a duration of approximately thirty seconds per cycle. As a result of this cleaning method, the copper particles are removed from the wafer immediately and permanently, thus greatly reducing the possibility of of redeposition. The process does not cause the substrate surface irregularities that are sometimes created as a result of the application of ozonized water and 1-IF. Growth of native oxide is also controlled to better expose the contaminating copper to the cleaning process. The process is carried out on a dedicated copper line to eliminate the possibility of cross contamination. Cost effective solution Copper strip OI~i 300 mm wafers can cut material recovery costs significantly. Noel’s copper strip process can prove both cost effective and timely considering many wafers sent for recovery may he recycled and thus saved from reclaim. “Our copper strip process represents the latest in cleaning technologies,” states Mr. Leon Pearce, Noel Technologies’ Chairmnan and Director of Technology. “Expanding and improving our wafer cleaning capabilities will provide our customers with a highly competitive, cost saving strategy - especially in the growing area of copper technology.” Noel Technologies provides specialized wafer foundry services including a fully integrated test wafer recovery program, low particle thin film deposition and particle measurement. Additionally, Noel offers new test, monitor and prime wafers for low particle thin film requirements. For further information regarding wafer reclamation and thin film services, please contact Ms. Kristin Boyce at Noel Technologies. Inc. (408) 374-9549. Located in the Silicon Valley and founded in 1996, Noel Technologies, Inc. is a leading provider of semiconductor wafers, custom thin films, wafer recovery and particle measuring services. For more information contact info@noeltech.com.

Noel Technologies, Inc.
1510-C Dell Avenue, Campbell, CA 95008
T: 408.374.9549 F: 408.374.4127

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