Service Definitions

THERMAL OXIDE: Thermal oxide (TOX) is one of the fundamentals films used in the manufacture of semiconductors. It is most commonly used as a field oxide, which serves as an insulator between the silicon substrate and other conductive films. Silicon dioxide differs from other conductive films. Silicon dioxide differs from other oxide coatings, as it is grown rather deposition (CVD) process. The result is a more uniform coating with fewer defects. Thermal oxide is grown in a diffusion furnace or in a rapid thermal processor (RTP). Most thermal oxides are grown at temperatures ranging from 800° C Ð 1,200° C in our large horizontal diffusion furnace.

PARTICLE GUARANTEED (PG) THERMAL OXIDE: Noel Technologies will guarantee a <70@ .2 µm oxide up to 10K A¼. PG is subject to material quality and the types of films grown on the substrate. Please contact sales@noeltech.com regarding your requirements and specifications.

OXIDE/ RESIST STRIP (Wafer Recycling): Wafer recycling is an etch process which will remove most semiconductor thin films if performed correctly. This recycling process will not alter the flatness or thickness of the wafer, which is a major benefit of recycling as opposed to reclaim. Wafer recycling is not a polishing process. Noel will sort wafers that are scratched, hazed or badly damaged. Customers can then choose to have their wafers reclaimed.

WAFER RECOVERING (Strip metal, Patterns, Poly, Oxide, Other Films): Reclaimed Wafers: Unlike reclaimed wafers available in the past, the reclaimed and recycled wafers available today are of very good quality. Reclaimed wafers may be made from prime wafers which have been stripped of photo resist, oxide, poly, nitride and metals. They are mechanically re-polished to remove film, surface scratches and residual patterns. After polishing, wafers are cleaned and batch sorted for thickness, bow/warp/flatness and resistivity. Thin film may then be applied to complete the process. The number of times a wafer may be reclaimed is limited, as the process physically reduces the thickness of the substrate. Eventually, test wafers become damaged, too deeply scratched or too thin to be reclaimed.

COPPER RECOVERY WITH RCA/ RPC/ SCROD CLEAN: Noel Technologies environmentally friendly, single wafer process begins by removing the copper from the wafer using carefully timed, multiple applications of fresh ozonized DI wafer combined with specially formulated terabit grade HF solution. The chemical materials required are approximately 25% of the total required by many other methods. Performed at room temperature, the highly effective, multiple cleaning cycles require a duration of approximately thirty seconds per cycle. As a result of this cleaning method, the copper particles are removed from the water immediately and permanently, thus greatly reducing the possibility of re-deposition. The process does not cause the substrate surface irregularities that are sometimes created as a result of the application of ozonized water and HF: growth of native oxide is also controlled to better expose the contaminating copper to the cleaning process. The process is carried out on a dedicated copper line to eliminate the possibility of cross contamination.

RCA/RPC CLEAN (Reduced Particle Clean): Noel Technologies’ (RPC) process for wafers is the most effective recovery technology offered among similar services. Custom manufactured equipment and a specialized process contribute to the superior results of Noel's RPC on recycled wafers of all sizes. Wafers received by Noel for recovery are stripped, cleaned and then sorted for LPDs. Particle count determines whether a wafer may be recycled or will require mechanical polishing. Wafers with 100 or fewer LPDs are accepted for recycling and will undergo the RPC process. Unlike the reclaiming process, ultra low particle cleaning allow quick cycle times before a wafer must be sent for reclaim due to haze, scratches or other similar damage.

SURFSCAN SERVICE Ð BIN COUNTS: Using a state of the art particle measuring tool, Noel Technologies can insure customers of very tight particle specifications. The pioneer in particle guarantee on thin films as well as reclaimed wafers, Noel accepts full responsibility for the quality of a customer’s reclamation process and custom thin films.

ENGINEERING TIME: Noel’s in-house engineering time for custom process and procedures are charged by the hour and the materials used. If you have a special request or a custom process you would like to develop, contact sales@noeltech.com for more information.

Site designed by Take Flight Graphics