| THERMAL OXIDE PROCESS |
4/5” |
6” |
8” |
12” |
Thermal Oxide 500 – 5K Angstroms
Below 500 Å – Call for quote
Below 2K Å – Target Thickness = ±10% |
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| Thermal Oxide 5,001 – 10k Angstroms |
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Thermal Oxide 10,001 – 20K Angstroms
Above 20K Å – Call for quote |
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Particle Guaranteed Thermal Oxide†
1k – 5k Angstroms on Particle-Monitors
<70 @ .2 Microns Guaranteed |
N/A |
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Particle Guaranteed Thermal Oxide†
5,001 – 10k Angstroms on Particle-Monitors
<70 @ .2 Microns Guaranteed |
N/A |
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| Target thickness = ±5% wafer uniformity = ±3% (Prime) ±5% (all others) |
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| PECVD FILMS PROCESS |
4/5” |
6” |
8” |
12” |
| Lto (siH4) 500 – 10k Angstroms |
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N/A |
| Lto (sih4) 10,001 – 20k Angstroms |
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N/A |
| Low-k oxide (k<3) 500 – 10k Angstroms |
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N/A |
Low-k oxide (k<3) 10,001 – 20k Angstroms
Above 20k Å – Call for quote |
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N/A |
Plasma enhanced Teos 500 – 10k Angstroms
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Plasma enhanced Teos 10,001 – 20k Angstroms
Above 20k Å – Call for quote |
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Silicon-carbide 500 – 5k Angstroms
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N/A |
Silicon-carbide 5001 – 15k Angstroms
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N/A |
| Target thickness = ±5% wafer uniformity = ±5% |
Polysilicon 1K – 5K Angstroms
Minimum Qty. 50 pieces |
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Polysilicon 5,001 – 10K Angstroms
Minimum Qty. 50 pieces |
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| Target thickness = ±10% wafer uniformity = ±5% |
| lpcvd silicon nitride 500 – 3K Angstroms |
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| Plasma nitride 1K – 10K Angstroms |
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| Oxy-nitride 500 – 10k Angstroms |
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N/A |
Oxy-nitride 10,001 – 20K Angstroms
Above 20k Å – Call for quote (up to 80k) |
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N/A |
Blanket Photoresist Coating 10k – 30k Angstroms
I-Line positive resist: Spin and Hardbake |
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$40.00 |
| Target thickness = ±5% wafer uniformity = ±5% |
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| WAFER RECOVERY PROCESS |
4/5” |
6” |
8” |
12” |
Oxide/RESIST Strip (up to 20k)1 with Film Deposition
(price does not include film charge – RCA/SRD Clean)12 |
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Oxide/RESIST Strip (up to 20k)1
with RCA/SRD Clean |
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Oxide/RESIST Strip (up to 20k)
with RCA/RPC™ Clean |
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Wafer Recovering with Film Deposition
(Price does not include film charge – RCA/SRD Clean)12
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Wafer Recovering (Strip Metals, Patterns, Poly, Oxide, Other films)
with RCA/SRD Clean12 |
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Wafer Recovering (Strip Metals, Patterns, Poly, Oxide, Other films)
with RCA/rpc™ Clean2 |
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| Copper Recovery with RCA/RPC™/SCROD Clean3 |
N/A |
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Kiss Polish with Film Strip
Minimum removal (~1-2 microns) |
N/A |
N/A |
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Kiss Polish
Minimum removal (~1-2 microns) |
N/A |
N/A |
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| No Particle Guarantees |
1Clean box = 5” = $3.50 – 6” = $4.00 – 8” = $8.00 – 12” = $35.00. Please add RPC™ (Reduced Particle Clean) for particle sensitive material.
2Multi-Layers = $5.00/Layer. Prior to pickup, noel must be notified of wafers with photo resist.
Non-compliance may result in an additional charge of $250.00 for bath/filter change.
3Spin-cleaning with repetitive use of ionized water and dilute hf.
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| WAFER CLEANING |
4/5” |
6” |
8” |
12” |
| RCA/SRD Clean |
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| RCA/SCRUB |
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| RCA/RPC™ (Reduced Particle Clean) |
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| No Particle Guarantees |
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| OTHER SERVICES |
4/5” |
6” |
8” |
12” |
Surfscan Service - Bin Counts
Setup Charge $250.00 – additional $1.50 per wafer charge for maps |
N/A |
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N/A |
Film Mapping
Polar Scans, 49-Point Measurements, etc. |
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Bow/Warp Measurements (TTV, TIR)
Minimum Charge $250.00 |
N/A |
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N/A |
Engineering Time
Special Cleans, Chemicals, and Gases will be billed separately |
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Incoming Inspection:
• Upon receipt of material, Noel visually inspects wafers for chips and cracks. Wafers with these types of defects will be rejected and returned unProcessed.
• Noel does not offer particle specs, or surface guarantees on recycled material.
• Noel is not responsible for wafers broken in Process.
Standard Specifications:
Modifications to Noel’s Standard Specifications must be submitted in writing, prior to acceptance of order.
| DEFECTS |
REJECT |
ACCEPT |
| Finger Prints |
0% |
100% |
| Chips/Cracks |
100% |
0% |
| Water Spots/Slurry |
0% |
100% |
| Haze |
Customer Spec |
Customer Spec |
| Scratches |
Customer Spec |
Customer Spec |
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Incoming Inspection:
• Upon receipt of material, Noel visually inspects wafers for chips and cracks. Wafers with these types of defects will be rejected and returned unProcessed.
• Noel does not offer particle specs on KISS-POLISHED material.
• Noel is not responsible for wafers broken in Process.
Standard Specifications (Frontside):
Modifications to Noel’s Standard Specifications must be submitted in writing, prior to acceptance of order.
| DEFECTS |
REJECT |
ACCEPT |
| Finger Prints |
100% |
0% |
| Chips/Cracks |
100% |
0% |
| Water Spots/Slurry |
100% |
0% |
| Pitting/Haze |
Customer Spec |
Customer Spec |
| Scratches |
Customer Spec |
Customer Spec |
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Returns: Noel must be notified of non-conforming films within 15 days of Customer’s receipt. Material must be returned for engineering evaluation/inspection, prior to Credit/Rework determination.
Minimum order requirement: 1 full cassette or $500, whichever is lower
Standard lead time: 5-7 working days / 7-10 Working Days For Minimum Orders of 75 Pieces or Less
Rush charge: 35% - 24 hour turn (upon acceptance)
Payment Terms: NET 30 Days
Noel Technologies offers other services not listed. If you
have special requirements please call for a specialized
quote or email info@noeltech.com.
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